Contract development

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Development and Support
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Research and Development

MONSTER PAC® Core Technology
FSNIP
DTF for Industry 4.0

Research and Development

Entrusted development corresponding to various kinds of semiconductor assembly is possible.

Our major assembly machines are wafer dicer, printing machine, flip-chip bonder. We also have equipment for quality control such as X-ray spectrometer, secondary electron microscope with EDAX, heat-cycling tester and so on. In addition, we can respond your any request in cooperation with our partner companies.

Dicing

Facility: Wafer Dicer

Facility: Substrate dicer

Facility: Wafer Mounter

Facility: UV Irradiator for Dicing Process

Chip Sorting

Facility: Chip　Sorter

Wire & Stud Bump Bonding

Facility: Wire & Stud Bump Bonder

Printing

Facility: Printer

Facility: DTF Printer

Dispensing

Facility: Dispenser

Flip Chip Bonding

Facility: Flip Chip Bonder ( Manual Alignment )

Facility: Flip Chip Bonder ( Automatic Alignment )

Facility: Ultrasonic Flip Chip Bonder ( Manual Alignment )

Facility: Ultrasonic Flip Chip Bonder ( Automatic Alignment )

Facility: DTF Flip Chip Bonder ( Automatic Alignment )

Reflow & Cure

Facility: N2 Reflow Oven

Facility: Clean Oven

Facility: Pressurization Clean Oven

Resin Molding

Facility: Sheet Molding Machine

SMD Chip Mounting

Facility: SMD Chip Mounter

Marking

Facility: Laser Marker

Reworking

Facility: Reworking Machine

Evaluating & Analyzing

Facility: Micro Manipulator

Facility: Depth Synthetic Microscope

Facility

・Shear Strength Meter

・IR Microscope

・Measurement Microscope

Facility: Laser Displacement Meter

Facility: Scanning Electron Microscope（SEM）

Facility: Scanning Acoustic Tomograph（SAT）

Facility: Ion Milling Machine

Facility: Automatic Polishing Machine

Facility: Pression Cutting Machine

Facility: Diamond Wire Saw

Facility: X-ray Inspection Machine

Facility: DC Test System

Facility: Manual Probing System

Facility: High Speed Camera

Facility: Thermal Cycle Test Chamber

Facility

・High Temperature Test Chamber

・High Temperature Humidity Test Chamber

Facility: Plasma Cleaner

Facility: Flux Cleaning Machine

Facility: Binding machine , Label printer & Vacuum lamination machine

Facility: Draft Chamber