Trial Process Menu
In addition to the MonsterPAC process,Various process menu available.
With various processes available, i.e. our original flip chip process “MonsterPAC®”, and many others, CONNECTEC JAPAN technology is very flexible and capable to design and assemble semiconductors, modules, and substrates (Ex. Ceramic, organic, film, etc.) to meet your special requirement with process and structure optimization.
Process menu list
Wafer Bump
| Process Step |
Process Materials,Equipment |
| Conductive paste printing |
Solder,silver,stencil printing |
| Stud bump |
Au-stud bump bonder |
| Electroless plating |
Ni/Au JCAP/domestic fab.outsourcing |
| Electroless plating,RDL,FOCSP |
JJCAP outsourcing |
Bump on substrates
| Process Step |
Process Materials,Equipment |
| Conductive paste/solder printing |
FPC,organic,ceramic substrate,stencil printing |
Wafer dicing
| Process Step |
Process Materials,Equipment |
| Wafer dicing |
Si,piezo device,blade-dicer |
Resin dicing
| Process Step |
Process Materials,Equipment |
| NCP,underfill dispensing |
NCP first,underfill last process |
Flip-chip bonding・Substrate bonding
| Process Step |
Process Materials,Equipment |
| Thermal bonding of conductive paste |
Ni/Au-silver,Thermo-press bonder |
| Solder melt-bonding |
Au-Solder flip-chip,FPC-chip |
| Ultrasonic bonding |
Au-Au ultrasonic flip-chip bonder |
| ACF bonding |
ACF manual bonder |
Cure
| Process Step |
Process Materials,Equipment |
| Bonding resin hardening |
NCP,underfill hardening |
Molding
| Process Step |
Process Materials,Equipment |
| Sheet molding |
Resin sheet,molding machine |
Marking
| Process Step |
Process Materials,Equipment |
| Marking |
Laser marker |
Substrate
| Process Step |
Process Materials,Equipment |
| Substrate dicing |
Organic substrate,ceramic blade dicer |
Testing
| Process Step |
Process Materials,Equipment |
| Electrical testing |
Open/short tester |
| Inspection system |
Microscopes |
Evaluation
| Process Step |
Process Materials,Equipment |
| Physical testing |
SEM,IR microscopes,Laserdisplacement gage,X-ray transmission
equipment,Measurement microscope |
| Reliability testing |
Thermal budget testing,constant temperature and humidity with bias |